CO2 Clean Technology for Electronic Device Fabrication
Microelectronic assemblies require high-volume and cost-effective cleaning during various stages of assembly and rework operations. Due to component compatibility problems and drying challenges, partially assembled devices cannot be immersed or sprayed with aqueous cleaners or solvents. CO2 Cleaning overcomes these constraints by providing high capacity, dry solvent-like spray cleaning capability. In many electronic device fabrication applications, selective cleaning of the surface is needed to remove localized contamination generated by processes such as pad preparation, cutting, and drilling
CO2 Cleaning is used in a variety of microelectronic device manufacturing and assembly processes, examples include:
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Adhesive Bonding,
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Functional Coating
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Encapsulation/Sealing
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Wire Bonding
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Welding
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Ceramic, Glass and Crystal Polishing
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Optical Device Assembly (and Test)
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Laser and Diamond Machining
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Microfluidic Device Fabrication
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Precision Device Assembly
Cleaning Process in Electronic Device Manufacturing
Cleaning Applications
Cleaning with CO2 provides material and process engineers with a robust surface treatment platform for challenging substrates with complex or microscopic geometries. As shown right, many different types of devices can be processed to address numerous contamination challenges including particulate matter, organic residues, outgassing residues, oxides, ionic residues, as well as process heat during machining processes.
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[A] Removal of laser welding oxides (alloys) from titanium neurostimulator electrodes.
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[B] Removal braze weld debris from electronic package.
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[C] Removal of fingerprint from CMOS image sensor
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[D] Removal of built-up aluminum and aluminum oxide particles from test probe contact.
Electronic Device Materials Cleaned with CO2
CO2 Cleaning applications have included many types of passive, electro-mechanical and electro-optical substrates with varying end-product performance requirements, and for many different markets including Biomedical, Military, HDD, and Aerospace. Examples of materials and applications relevant to microelectronic device manufacturing are show below.
